Selecting a Cold Plate: Which Design Fits the Application?

Monopress, Multipress, Interpress, Structureflow or Embeddedflow: five different designs, one task. All five cool reliably, but under different conditions. Which fits depends on power density, installation space, coolant medium, and the required degree of functional integration.

These Factors Determine the Choice of Design

  1. 1

    Heat Flux Density

    High power dissipation on a small area requires a cooler with a high k-value. Structureflow and Interpress are suitable for very high power densities; Monopress and Multipress for medium to high power dissipation.

  2. 2

    Coolant Path and Cooling Sides

    Single-sided cooling? Monopress. Cooling from multiple sides of a component? Multipress. Uniform bilateral cooling via internal tube? Interpress. Maximum internal structure? Structureflow.

  3. 3

    Installation Size, Weight and Shape

    Flat aluminium coolers are lightweight and compact. Embeddedflow combines cooling and housing structure in one component, useful when form and function are to be unified.

  4. 4

    Media Properties

    For aggressive media, pure water, or extreme temperatures, stainless steel or copper tubes offer advantages over aluminium. The choice of material also depends on the coolant medium and the system environment.

  5. 5

    Functional Integration

    Embeddedflow combines cold plate and housing in a single assembly. Suitable for applications where the cooling system is also to serve as carrier or protective housing.

Cold Plate Designs at a Glance

DesignParticularly Suited for
MonopressPressed-in tubes - single-sidedHigh power dissipation, wide media choice, standard applications
MultipressPressed-in tubes - multi-sidedComponents that need to be cooled from multiple sides
InterpressInternal tube - uniformly bilateralUniform temperature distribution on both sides of the base plate
StructureflowInternally structured channels / pinsMaximum power density, hotspot cooling, highest k-value
EmbeddedflowHousing with integrated cooling circuitMultifunctional assemblies with cooling + housing function

Frequently Asked Questions

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