Extruded Heat Sinks
Find out how our extruded heat sinks can optimally support your application as well.
BONDFIN
Bonded Fin Heat Sinks
Bondfin heat sinks provide maximum cooling performance in minimal space thanks to densely packed fins – ideal for high thermal loads.
Contact usFrom raw profile to finished solution: how we make your Bondfin air-cooled heat sink ready for use
Exceptional base-to-fin ratios
Virtually no limits for minimal spacing between fins
High fins achievable even with thin base plates
Significantly more flexible than conventional extruded heat sinks
Optimal thermal management
Large surface area for efficient heat dissipation
Excellent thermal connection between fins and base
Suitable for bonded fin heat sinks of any size and demanding thermal management applications
Customized machining
From machining to module assembly
Over 30 semi- and fully automated 3-, 4- and 5-axis CNC machining centers
In-house welding, soldering, and bonding technologies
Manufacture of complex heat sinks of any kind with short cycle and delivery times
Performance optimization for bonded fin heat sinks by COOLTEC
Bonded fin heat sinks already offer highly efficient heat dissipation thanks to their unique design. To further enhance cooling performance, COOLTEC implements targeted performance optimizations – particularly through the use of pressed-in heat pipes and integrated copper inserts. These measures improve heat distribution within the heat sink, lower operating temperatures of sensitive electronics, and increase their lifespan.
Pressed-in heat pipes
Pressed-in heat pipes efficiently transfer heat from the source to the fins. The fluid inside evaporates at hot spots, transports the heat via vapor, and condenses in cooler areas. This closed-loop process distributes heat evenly throughout the entire cooling structure – ideal for localized hotspots and high thermal loads.
Copper inserts as heat spreaders
Copper inserts act as effective heat spreaders. With significantly higher thermal conductivity compared to aluminum, they ensure uniform temperature distribution – especially under heavily loaded components or media-carrying structures. This prevents local overheating and ensures stable electronic operation.
What is a bonded fin heat sink?
Bonded fin heat sinks consist of individually joined fins that are soldered, bonded, or welded to a base plate. This design allows for extremely fine fin spacing and a large surface area for efficient heat dissipation. Compared to extruded profiles, this technology enables much more compact and powerful heat sinks – ideal for applications with high heat density and limited installation space.
Learn more in a consultationKey advantages at a glance
Large cooling surface for optimal heat dissipation
Customizable fin height and spacing
Versatile joining techniques (soldering, bonding, welding)
Compact design for limited space
High reliability and long service life of electronic components
Looking for an efficient and reliable cooling solution for your power electronics?
Our engineering team is happy to advise you on selecting and developing your ideal heat sink – individually, precisely, and quickly.
Frequently Asked Questions
A bonded fin heat sink is a component for efficient heat dissipation. Its thin, fin-like structures provide a large surface area, allowing heat from electronic components to be effectively transferred to the air.
Bonded fin heat sinks are made of individual fins permanently connected to a base – for example, through soldering, welding, or bonding. This design allows very thin bases and narrow fin spacing for particularly high cooling performance.
Bonded fin heat sinks feature a large surface area, efficient heat dissipation, compact design, flexible configuration, and longer component lifespan.
Additional technologies such as pressed-in heat pipes or copper inserts as heat spreaders help distribute heat faster and more evenly. This enables better cooling of local hotspots and enhances overall performance.
Bondfin is a COOLTEC-developed method for manufacturing bonded fin heat sinks. It enables exceptional fin-to-base ratios, minimal fin spacing, and high fins with thin bases – perfect for high cooling demands and limited installation space.
