
Single-Sided Pressed Tubes
Single-sided pressed copper, aluminum, or stainless steel tubes for high power losses. (...)
Thermal conductivity λ determines how well a material dissipates heat. This overview provides the definition, formula, and a table of λ values for cooling engineering.
Thermal conductivity indicates how well a material conducts heat. Its symbol is λ (lambda), the unit is watts per meter and kelvin, W/(m·K). A high λ value means good heat transport, for example copper at about 400 W/(m·K). A low value means good insulation, for example air at about 0.026 W/(m·K).
Thermal conductivity follows from Fourier's law. From a measured heat flow, λ can be determined as follows:
λ = (Q̇ · d) / (A · ΔT) Example: A 10 mm thick aluminium plate (λ = 200 W/(m·K)) with 0.01 m² area at a 5 K difference transfers Q̇ = λ · A · ΔT / d = 200 · 0.01 · 5 / 0.01 = 1000 W.
The thermal resistance of a layer follows as R_th = d / (λ · A) in K/W. Unlike λ, R_th and the U-value also depend on geometry and thickness.
The table lists typical λ values at around 20 °C, sorted in descending order and focused on metals and cooling materials. Report values and general physics constants are marked.
| Material | Thermal conductivity λ (W/(m·K)) | Relevance for cooling |
|---|---|---|
| Silver | ~429 | Highest conductivity of all metals, too expensive for series use and therefore a reference value only. |
| Copper (pure) | ~400 (398-401) | Best practically usable heat conductor, ideal for hotspots, copper inlays, and heat spreaders. Heavy and expensive. |
| High-conductivity copper alloys (e.g. CuCrZr, CuAg) | 305-394 | Only slightly below pure copper, used where high conductivity and higher strength are needed together. |
| Aluminium (pure) | ~235 | Very good conductor at low weight, the basis of most heat sinks. |
| Aluminium alloys (heat sink) | 125-210 (typ. 150-200) | Standard material for heat sinks and cold plates: light, inexpensive, extrudable, and machinable. |
| Graphite | 130-160 tech. (up to 2000 in-plane) | Anisotropic and light, high in-plane conduction for heat spreading. |
| Sintered ceramic (AlN, BN) | 100-200 | Conducts heat and insulates electrically at the same time, ideal near sensitive circuits. SiC, by contrast, is a semiconductor. |
| Brass | ~110 (approx. 80-120) | Medium conductivity, used more for connectors and fittings. Strongly alloy-dependent. |
| Steel (unalloyed) | ~50 | Clearly a poor conductor, used structurally rather than thermally. |
| Copper-nickel (CuNi) | ~20-50 | Significantly lower conductivity than pure copper, chosen for its corrosion resistance in pipes and corrosive coolants. |
| Stainless steel (V2A/V4A, austenitic) | ~15-16 | Poor heat conductor but very corrosion-resistant, for channels and pipes combined with an aluminium base body. |
| Thermal paste/pad (TIM) | ~1-12 | Fills microgaps at contact surfaces and lowers the contact resistance. Product-dependent, check the manufacturer value. |
| Water (coolant) | ~0.6 | Transports heat by convection, not by conduction. Reference for liquid cooling. |
| Air | ~0.026 | Very poor conductor, which is why heat has to be actively dissipated. |
Both materials dominate heat sink construction. The table compares the decisive properties.
| Criterion | Copper | Aluminium |
|---|---|---|
| Thermal conductivity | ~400 W/(m·K) | ~200 W/(m·K) |
| Weight | high (dense material) | low |
| Material cost | higher | lower |
| Corrosion | resistant, oxidizes slowly | very resistant with an anodized layer |
| Manufacturing | more demanding to machine | easy to machine and extrude |
Copper wins with high heat density and tight installation space, aluminium with weight and cost. COOLTEC combines both through copper inlays in an aluminium base body: high conductivity exactly where the heat load is greatest.
Even poor heat conductors have their place in a cooling system when other properties matter.
In practice, λ alone does not decide, but the interplay of several requirements.
Unsure which material suits your application? COOLTEC advises you on material selection and sizes your cooling, free and without obligation.
Learn how to optimize cooling for high-tech applications – with solutions that are efficient, reliable, and ready to implement.
Download report