Stable grids need cool electronics, with as little maintenance as possible
Inverters, grid couplers and storage systems run for decades, often at hard-to-reach sites. We design heat sinks for power electronics in the energy sector. They are built for continuous load, low maintenance and long-term availability.



More than the power semiconductor module gets hot in the plant.
Besides power semiconductors we cool busbars, chokes, transformers and housings. On these components in particular, cooling decides the permissible continuous power and the size of the unit.
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IGBT & SiC modules
High current densities with long load-cycle endurance.
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Power rails & busbars
Absorbing waste heat in the power distribution.
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Chokes & filters
Passive components with high continuous losses.
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Transformers
Even temperature control across large areas.
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Battery storage
Cell temperature control for service life and safety.
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Housings & switchgear
Air-to-water cooling instead of an air conditioner.
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Charging infrastructure
Power electronics in fast-charging systems.
Continuous load · Low maintenance · Lifecycle
Plants in the energy sector run for decades, often without regular access. So we do not design for the best figure but for the figure that still holds after twenty years.
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Continuous load
Designed to the real load profile with reserve for contamination and ageing of the circuit.
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Low maintenance
Flushable geometries, matched material pairings and media keep maintenance predictable.
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Lifecycle
Framework contracts, stockholding and last-time buy across the entire plant lifecycle.
What we supply for the energy sector
- Cold plates (liquid cooling plates) : for IGBT and SiC modules up to the MW range.
- Busbar coolers : for busbars and distribution.
- Control cabinet cooling : air-to-water instead of an air conditioner.
- Nachfertigung : for existing plants and obsolescence cases.

Three designs that make the difference in energy.

Multipress
Press-fitted tubes in the cold plate: a robust, process-reliable design for large areas and long parts. Available in copper, copper-nickel, stainless steel or aluminium.

Structureflow
Cooling channels integrated directly into the load-bearing structure. That means fewer interfaces, less thermal resistance and one part instead of an assembly.

Turbulators
Up to 40 % more cooling capacity at an acceptable pressure drop. We position them to the millimetre beneath your hotspots.
Everything from one source, from development to series production.
COOLTEC handles your thermal management completely: one contact, one process, from the first idea to series delivery. You join wherever you stand. Development, simulation and design are optional.
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Development & simulation
We develop, simulate and design your cooling solution. We test it virtually before we produce anything physically.
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Manufacturability & cost
You already know what you need? We assess manufacturability and optimise your design for series production.
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Samples & prototypes
Samples in around 6-8 weeks as standard, or 2-4 weeks by express, depending on product and complexity.
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Series production
From one supplier: highly automated high-tech manufacturing in Germany, low-cost series from Asia.
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Supply & lifecycle
Framework contracts, stockholding, last-time buy: we secure your supply across the entire product lifecycle.



Energy Thermal Guide: cooling for grid and power electronics
Design knowledge rather than a product catalogue: what cooling solutions look like when they have to work for decades at hard-to-reach sites.

Sebastian Krüger
Bring your thermal challenge: heat load, installation space, medium, ambient conditions. In the first call Sebastian works out the right approaches with you and puts together the team we need for it, from application engineering, production engineering and thermal engineering. You will not be put on hold.
Frequently asked questions
At what heat load is an air-cooled heat sink no longer enough in power supplies?
In power supplies, air cooling typically reaches its limit above roughly 5 to 10 W/cm² of heat flux density. What matters is not the absolute power but the area over which it has to be dissipated. An IGBT module with 3 kW of losses on a large base plate is manageable with air cooling; the same 3 kW on a SiC module with a quarter of the area is not. The second limit is installation space: air cooling needs fin height and air volume, a cold plate does not. A practical guide from customer projects: from around 2 kW per assembly, or where heat sink temperatures below 60 °C are required at 40 °C ambient, liquid cooling is usually the simpler solution. Conversely, as long as air is enough, air is cheaper and needs less maintenance, so you should not switch to liquid.
Read more –>How do you achieve a specified thermal resistance, for example Rth below 0.02 K/W?
A specified thermal resistance comes from three quantities: the internal structure of the cold plate, the volume flow and the position of the heat sources. For targets around 0.02 K/W with several heat sources, a tube-based cooler usually will not get there; an internally structured plate with the channel directly beneath the source will. Important for your enquiry: Rth cannot be verified without stating volume flow, inlet temperature and reference area. The same plate achieves a far better value at 8 l/min than at 2 l/min. We calculate the design by thermal simulation and state the value achieved together with the corresponding boundary conditions. Limit: below certain values the pressure drop rises so steeply that the pump becomes the cost driver, and we check that as well.
Read more –>May the heat sink be at electrical potential, and how is insulation verified?
A heat sink can be at potential. That is a regular case in power electronics, and it mainly affects the choice of coolant and connections. With coolers at potential you work with insulating hose sections of defined length, deionised water or insulating interlayers; the clearances follow insulation coordination (DIN EN 60664-1, EN 50124 in rail applications). For partial discharge testing in the kilovolt range, edge rounding and surface quality matter too, because field peaks form at burrs. COOLTEC manufactures and tests the mechanical side; the insulation design and the partial discharge test of the overall assembly lie with the system manufacturer, because they depend on the complete environment. For that we supply drawing data on radii and surfaces and match the connection geometry to it.
Read more –>How is heat transfer between power module and cold plate made as good as possible?
With a good design, the transition between module and cold plate is the largest single resistance in the entire path, not the cold plate itself. Three things are decisive: flatness of the mounting face, surface roughness and a uniform bolt tightening pattern. For power modules we machine the contact face flat to 0.05 mm across the module area and state the values achieved in the drawing. Thermal paste or foil only compensates residual unevenness; a thick layer of paste degrades the transition rather than improving it. Limit: with very large module areas, distortion of the module itself limits the result. Even better flatness of the plate then adds nothing, and you work via the bolt pattern and contact force.
Read more –>What is the minimum order quantity, and is a single prototype possible?
Single pieces and small series are the norm, not the exception: a large share of our enquiries begins with 1 to 10 units, often as a prototype ahead of a series decision. For customer-specific cold plates there is no minimum quantity in the classic sense. The unit price falls with quantity because set-up and programming effort is spread. It is different with a dedicated extrusion profile: that requires tooling which only pays off above a certain annual volume; until then you work with an existing profile from the profile database and adapt it mechanically. Limit: for single pieces the set-up effort dominates the price so strongly that the unit price is not comparable with a series calculation. That is set-up time, not pricing policy.
Read more –>To which standard is COOLTEC certified?
COOLTEC is certified to DIN EN ISO 9001:2015 (TÜV Thüringen), scope: development, production and sale of heat sinks and cold plates plus accessories for the electronics industry. For industry-specific requirements (fire behaviour in rail vehicles or material certificates in aviation, for example) we provide evidence through material and test certificates from our suppliers plus our own test records, not through our own system certification to the respective industry standard. In practice that means: we supply material certificates, leak and pressure test records and dimensional reports, and we know the requirements of the relevant standard. The declaration of conformity for the end product is issued by the system manufacturer. If you have a specific certification as a supplier requirement, tell us early, and we will clarify before the quotation whether we can meet it.
Read more –>How do you design for thermal resistance?
We start from your load case: heat load, distribution across the area, permissible component temperature, inlet temperature, volume flow and installation space. This yields the Rth budget. We test it in thermal simulation against variants of the channel routing before design work begins.
How do you design for twenty years of operation?
We calculate with the load profile rather than the data sheet maximum and plan reserve for contamination and ageing of the circuit. We also consider load-cycle endurance, which determines the service life of the joints.
Which materials do you process, and how do you choose correctly?
We work in copper, copper-nickel, stainless steel and aluminium. The choice follows three criteria: thermal conductivity, media compatibility and mechanical requirement. We frequently combine materials: conductive material at the heat source, resistant material at the medium.
How do you ensure leak tightness?
Pressure testing of every part is our standard; for demanding applications we additionally test with a helium leak test and document the leak rate per part. We set the target leak rate before design.
In which sizes do you manufacture heat sinks and liquid cold plates?
We build everything from a 30 mm microchannel cooler to a 3 m (30,000 mm) cold plate, right up to a fully cooled large precision part. Size alone does not decide what is possible; material, design and tolerance do. Give us your dimensions and we will tell you in which design we can produce them.
Do you also build for the MW range?
Yes. Part lengths up to around 3 m and large-area cold plates are part of our standard range.
How do you deal with corrosion in the circuit?
The most common cause is the material pairing, not the part itself. We agree material, medium and inhibitor together; for mixed installations we recommend separate circuits.
Which quantities and lead times are possible?
Samples in around 6-8 weeks as standard, 2-4 weeks by express. For series production we manufacture in a highly automated plant in Germany; cost-sensitive standard parts come from our joint ventures in Asia.
Do you work under NDA?
Yes, that is the norm for us. We sign your non-disclosure agreement or provide ours. We never pass on customer projects or application details.
Cooling in the energy sector: what matters technically
How we design a cooling solution
Every design starts from the same boundary conditions: heat load Pv, maximum permissible component temperature, ambient or inlet temperature and the available contact area. Only these determine which cooling strategy is feasible at all.
The four key parameters of a thermal system
Five steps to the right cooling solution
What influences the thermal resistance of an air-cooled heat sink
Materials: thermal conductivity and flow limits
The choice of material determines thermal performance and service life. If the flow velocity in the tube exceeds the maximum recommendation, the medium mechanically removes the protective passive layer, which leads to erosion and leakage.
| Material | Thermal conductivity at 20 °C | Max. flow velocity |
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| Copper / copper alloys | 305–394 W/m·K | 2,0 m/s |
| Aluminium / Al alloys | 125–210 W/m·K | 1.8 m/s (structures 1–2 m/s) |
| Copper-nickel (CuNi) | - | 3,5 m/s |
| Stainless steel | low conductivity, very good corrosion resistance | 4,5 m/s |
| Graphite (parallel to the layer plane) | up to 2000 W/m·K, technically 140–160 W/m·K | - |
| Sintered ceramics (BN, SiC) | 100–200 W/m·K, electrically insulating | - |
The data we need for your design
The more complete the boundary conditions, the faster we get from a first estimate to a reliable CFD simulation. This checklist comes from the Cool How Report and is the basis of every design discussion.
Load cycling instead of continuous load
Power semiconductors do not age from high temperature alone but from temperature cycling. Every cycle stresses the bonding layers inside the module.
We therefore design not only for the maximum junction temperature but for the smallest possible temperature swing across the load cycle.
Materials, media and corrosion
Copper, aluminium and stainless steel in the same circuit without a suitable medium reliably lead to corrosion, and it shows up years after commissioning.
We agree material choice, medium and surface treatment together and document the release. For mixed installations we separate the circuits.
Availability across the plant life cycle
Plants run longer than most supply chains. The most expensive failure is the one with no spare part left.
Framework contracts, stockholding and last-time buy are therefore part of our standard offering, as is the repeat production of parts from existing plants.
From prototype to series
The most expensive mistake is a prototype that works thermally but cannot go into series. That is why we assess manufacturability and cost in parallel with the thermal design, not afterwards.
Because development, manufacturing, testing and delivery are all in one hand at COOLTEC, nothing is lost at these transitions, from the first load case to the last-time buy.
Get the Energy Thermal Guide
Three details, one click, instant download. After that you decide whether we talk about your project.
Is your power electronics running at its thermal limit?
Send us your load profile: heat load, operating time, installation space, medium. We will tell you whether and how we can solve it.