Embeddedflow Enclosure cooler with cooling circuit

Integrated component cooling with or without cooling circuit and with the functionality of a fully functional enclosure.

  • Maximum customisation

    There are few limits to your design in the field of embedded flow technology. We do what is technically possible.

  • State-of-the-art joining processes

    We use the right joining process for your application, from friction stir welding and laser welding to vacuum brazing or bonding.

  • Wide range of connection options

    We offer in-house developed and common standard connections. Customised special connections are also possible. Whether internal or external.

Functional Design of Cooling Components

embeddedflow product exploded view example 1
embeddedflow product exploded view example 2

Enclosure heat sinks with or without a media-conducting channel offer versatile solutions for the effective dissipation of heat in demanding applications. Customisable structures such as fins, ribs or channels allow the cooling performance to be optimally tailored to the respective requirements. Depending on the design and area of application, the heat sinks are manufactured using precise processes such as soldering, welding or bonding to ensure a reliable thermal connection. The flexible combination of internal structures and manufacturing techniques allows efficiency to be increased, which not only ensures performance, but also optimises the costs and competitiveness of your application.

Portrait of Alexander Adamczewski, head of thermal engineering

If you not only want to protect your electronics from external influences, but also need perfect cooling, then 'embedded systems' are the way to go.

Alexander Adamczewskihead of thermal engineering

Product Examples

gehaeusekuehler mit kuehlkreislauf beispielprofil embeddedflow cool tec 1
gehaeusekuehler mit kuehlkreislauf beispielprofil embeddedflow cool tec 2-1
gehaeusekuehler mit kuehlkreislauf beispielprofil embeddedflow cool tec 2-2

Performance Optimization

Optimizing the performance of heat sinks maximizes heat dissipation, leading to higher efficiency and longer lifespan of electronic components. This enables devices to operate more stably and energy-efficiently, while also reducing failure rates. Optimized cooling also lowers operating costs and increases overall performance in demanding applications.

medienfuehrende einsaetze beispiel fluessigkuehler schnittansicht

Media-Carrying Inserts

Media-carrying inserts, often made of alternative materials such as copper, allow for even more efficient heat dissipation. They transfer heat directly to the circulating cooling medium. Media-carrying inserts are available in various materials and alloys and can be combined with common technologies, such as embedded pipes.

kupfereinsaetze einsaetze beispiel fluessigkuehler schnittansicht

Copper Inserts as Heat Spreaders

Embedded heat spreaders, typically made from alternative materials like copper, ensure optimal heat distribution. Whether located directly under media-carrying circuits or in other areas, copper inserts enable a more stable operating temperature and an extended lifespan for electronic components.

eingebettete waermerohre beispiel fluessigkuehler schnittansicht

Embedded Heat Pipes

Embedded heat pipes enhance heat distribution in heat sinks. These pipes utilize phase-change technology, where a liquid inside the pipe evaporates and condenses at different points. This significantly increases cooling efficiency, reduces hotspots, and ensures stable operating temperatures in high-performance applications.

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Schedule Your Meeting

Schedule your personal appointment with us today and let our thermal management experts advise you on the optimal cooling solution!

Sustainability in Products and Processes

economical. environmental. earth-centered. Explore the sustainable aspects that Cool Tec Electronic GmbH offers in terms of ecology and economy.

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