Pressing

Force-Fit & Form-Fit

Force-fit connections involve mechanically joining components through applied pressure, resulting in a strong and reliable bond. Form-fit refers to the precise matching of parts, which ensures optimal sealing and mechanical stability. Specifically, pressing pipe geometries with force-fit and form-fit, without the use of external media, enables the production of highly efficient liquid coolers that impress with their performance and durability.

Process & Pipe Geometries

During pipe pressing, also known as tube expansion or roll bonding, precisely fabricated pipe geometries are pressed into specially prepared cooling plates or heat sinks made of aluminum or copper. This process and the groove geometry ensure that the pipe is firmly anchored within the cooling structure, providing excellent thermal coupling and efficient heat transfer between the pipe and the heat sink. The direct thermal connection between the cooling medium in the pipe and the surface of the heat sink allows for extremely effective heat dissipation, significantly enhancing the thermal performance of the entire cooling solution.

This technology is particularly used in high-performance applications requiring precise temperature control and maximum heat dissipation, such as inverters, power transistors, or LED lighting. A major advantage of pipe pressing is its high process stability and repeatability, ensuring consistently high-quality cooling solutions. The use of force-fit and form-fit creates a metallic bond between the pipe and the heat sink, offering excellent thermal conductivity and extreme mechanical durability. This makes liquid coolers produced this way especially resistant to thermal and mechanical stresses, as commonly found in industrial or automotive applications. Moreover, this technique enables a compact design, as no additional sealing materials or connectors are required, making the overall construction lighter and more space-efficient. By using aluminum or copper pipes in combination with heat sinks of the same materials, optimal compatibility and thermal efficiency are achieved.