Copper Technologies for Maximum Thermal Conductivity

Advantages of Copper in Cooling Technology

With its exceptional thermal conductivity, electrical efficiency, and formability, copper is the preferred material for high-performance heat sinks and liquid cooling plates. It enables precise temperature control, increases the lifetime of electronic components, and guarantees maximum reliability in power electronics.

• Superior Thermal Conductivity

  With a thermal conductivity of around 400 W/mK, copper dissipates heat about twice as efficiently as aluminum. This keeps electronic component temperatures stable even at high power densities – crucial for longer service life and higher efficiency.

• High Electrical Conductivity

  Copper combines heat and electrical conduction in one material. Thanks to its excellent electrical conductivity, it is ideal for applications requiring minimal losses and maximum current-carrying capacity – such as in inverters, power transistors, or telecommunication systems.

• Mechanical Strength and Formability

  Copper is strong yet easily formable. This allows thin-walled, complex heat sink structures with high robustness. It can be extruded, deep-drawn, or precision-cast and is also suitable for microchannel structures.

• Ideal for High-Performance Applications

  Copper is preferred where maximum heat dissipation is required in limited space – such as in power electronics, energy conversion, telecommunications, or data centers.