Shipping and Marine
Discover how efficient cooling in motors, control systems, and power supply units enhances safety and performance at sea.
STRUCTUREFLOW
Internally structured cooling plates for liquid cooling
Milled or inserted channel and pin structures increase cooling performance and ensure stable temperatures in high-performance applications.
Learn more in a conversationFrom base material to efficient internal structure
Best possible performance:
Individually designed cooling structures (milled or inserted)
Channels or pin structures for maximum thermal performance
State-of-the-art joining methods:
Selection adapted to the application
Processes: friction stir welding, laser welding, vacuum brazing, or bonding
Double-sided cooling:
Uniform component cooling from both sides
No need for tubes on both sides
Functional design of Structureflow cooling components
Liquid coolers with milled or inserted structures provide maximum flexibility and thermal performance.
Complex geometries such as channels, pins, honeycombs, or fins can be realized. The suitable joining method is selected individually – from friction stir or laser welding to vacuum brazing or bonding. The combination of internal structure and joining method ensures efficient heat dissipation, stable temperatures, and high cost efficiency.
Learn more in a conversation
Key advantages at a glance
Custom channel and pin structures for optimal cooling performance
Flexible manufacturing process: welding, brazing, bonding, or additive methods
Implementation of complex geometries for efficient heat dissipation
High thermal stability and uniform component temperatures
Performance optimization with channel and pin structures
Structureflow coolers can be specifically optimized to dissipate heat efficiently. Thermal simulations support the optimal arrangement of channels, pins, heat pipes, and fluid-carrying inserts. Hotspots are reduced, components are cooled evenly, and the service life of electronic parts is extended.
Fluid-carrying inserts
Copper or stainless-steel inserts transfer heat directly to the cooling medium, increasing the efficiency of your liquid cooling. Various alloys and surface treatments are available to prevent corrosion and extend lifespan.
Fluid-carrying inserts can be easily combined with milled or inserted channel and pin structures, ensuring even heat distribution across the entire cooling plate.
Copper inserts as heat spreaders
Copper inserts provide stable heat distribution, specifically reduce hotspots, and improve consistent temperature control across the cooler. Especially in high-performance or space-limited applications, they stabilize the operating temperatures of sensitive components and extend the lifetime of electronic modules.
Embedded heat pipes
Embedded heat pipes use phase-change technology, where liquid evaporates and condenses at cooler points. This enables extremely efficient heat transfer and minimizes hotspots. The technology is ideal for compact, high-performance applications where even temperature distribution is critical, significantly enhancing the thermal performance of structured and pin-type coolers.
Thermal simulation & development
COOLTEC’s digital thermal simulation enables fast, precise, and resource-efficient development of your cooling solution.
Whether analyzing existing designs or developing new ones, we optimize performance, material use, and installation space for maximum cooling efficiency.
More power through precise thermal management
Whether high-performance electronics or compact space: we develop cooling systems that combine performance and reliability. Fast, precise, and customized.
Frequently Asked Questions
Structureflow coolers are ideal for applications with complex thermal requirements, high power density, or irregular component geometries. They provide uniform cooling and maximum efficiency.
Standard materials include copper, aluminum, or stainless steel. Special alloys can be used depending on requirements for thermal conductivity, weight, and corrosion resistance.
The structures are milled or inserted to enhance heat dissipation. They allow targeted fluid flow and significantly improve thermal performance.
