Structureflow Internally structured cooling plates

Liquid heat sinks with milled or inserted channel or pin structures.

  • Optimal Performance

    Customised cooling structures in the form of milled or inserted channel or pin structures enable the best possible thermal performance.

  • Advanced Joining Techniques

    We use the right joining process for your application, from friction stir welding and laser welding to vacuum brazing or bonding.

  • Dual-Sided Cooling

    Ideal if your application requires component cooling on both sides and you do not need a pressed-in tube on both sides.

Functional Design of Cooling Components

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Liquid heat sinks with internal structures offer you maximum flexibility and maximum performance in the field of liquid cooling. Whether complex pin structures, honeycomb, fin or layer structures - everything that is technically feasible can be realised. The appropriate joining process is customised, from classic soldering and welding processes with or without vacuum to adhesive or additive manufacturing processes. The perfect combination of internal structure and joining process not only ensures optimum cooling performance, but also a high level of cost-effectiveness that makes your application competitive.

Thermal Simulation

We support you and your team in the shortest possible time with the design of your cooling solution. Using thermal simulations and based on over 30 years of manufacturing expertise, we optimize or design the cooler that fits your application.

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Your Benefits in 2 Weeks

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Product Examples

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Performance Optimization

Optimizing the performance of heat sinks maximizes heat dissipation, leading to higher efficiency and longer lifespan of electronic components. This enables devices to operate more stably and energy-efficiently, while also reducing failure rates. Optimized cooling also lowers operating costs and increases overall performance in demanding applications.

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Media-Carrying Inserts

Media-carrying inserts, often made of alternative materials such as copper, allow for even more efficient heat dissipation. They transfer heat directly to the circulating cooling medium. Media-carrying inserts are available in various materials and alloys and can be combined with common technologies, such as embedded pipes.

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Copper Inserts as Heat Spreaders

Embedded heat spreaders, typically made from alternative materials like copper, ensure optimal heat distribution. Whether located directly under media-carrying circuits or in other areas, copper inserts enable a more stable operating temperature and an extended lifespan for electronic components.

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Embedded Heat Pipes

Embedded heat pipes enhance heat distribution in heat sinks. These pipes utilize phase-change technology, where a liquid inside the pipe evaporates and condenses at different points. This significantly increases cooling efficiency, reduces hotspots, and ensures stable operating temperatures in high-performance applications.

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Schedule Your Meeting

Schedule your personal appointment with us today and let our thermal management experts advise you on the optimal cooling solution!

Sustainability in Products and Processes

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