Development & Design, Thermal management

Green Transformation – Challenges in Electronic Cooling

We are living in the era of green transformation!

All processes and technical applications must be made emission-free as quickly as possible. For this purpose, renewable energies such as solar power and wind energy are being massively expanded. Fossil fuel-based drive systems are being replaced by more sustainable alternatives like electromobility.


windmill-grüne-transformation

Impact on Electronics

The continuous advancement of technologies leads to increasingly higher power densities in electronics. However, the available space does not increase accordingly. On the contrary, space optimization is often a priority due to cost considerations. Consequently, power losses in inverters, transistors, IGBTs (Insulated Gate Bipolar Transistors), or other semiconductor components are increasing.

Typical applications include inverters for photovoltaic systems, power electronics for wall boxes and charging stations, 5G antennas, and many more. In many redesigns, power losses have doubled despite the same or even reduced space requirements.

Due to the increasing power densities in smaller spaces, electronic components like inverters or IGBTs need to be cooled more effectively. While conventional air cooling with extruded aluminum heat sinks (also known as finned heat sinks, profile heat sinks, or comb profiles) was the standard, the current power densities often demand active cooling elements such as liquid coolers (also called cold plates or liquid cooling plates).

The wide range of heat sink products and manufacturing technologies makes sustainable thermal management essential. The ecological footprint of electronic cooling must not be neglected in this transformation.

 

The Path to Efficient Cooling in Power Electronics

Although power electronic components like IGBTs or inverters are sold as standard units, the required cooling solution is often not standardized due to varying applications, operating conditions, space availability, and other factors.

An individually developed cooling solution tailored to specific requirements is often key to effective, efficient, and sustainable thermal management. Suitable solutions include air coolers, liquid coolers (liquid cooling plates or cold plates), or more complex boiling cooling systems. Each product category involves various performance and manufacturing aspects that should be defined on a project-specific basis. Sustainable manufacturing technologies should be prioritized to minimize the overall module footprint while remaining economically viable.

Optimized electronic cooling not only maximizes the lifespan of electronic components but also reduces the overall application footprint. This can even be achieved under economic considerations, maintaining the cost-effectiveness of the application.

At Cool Tec Electronic, we focus on modern CAE methods for developing and optimizing heat sinks in power electronics. Complex thermal simulations using advanced software ensure sustainable, cost-effective development. The development cycle is shortened, and the need for multiple prototypes is reduced, enabling faster series production.

By considering manufacturing processes, we find the right balance between performance, cost-effectiveness, and sustainability. Our goal is to design and produce a functional cooling solution for the entire product lifecycle.

Author: Benedikt Lausberg

Published on 10.11.2022

© 2025 - Cool Tec Electronic GmbH

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